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datasheet product structure silicon monolithic integrated circuit this product is not designed for protection against radioactive rays 1/20 14.dec.2015.rev.004 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201-0gbg0a600020-1- 2 cmos ldo regulator for portable equipments high ripple rejection, low current consumption, versatile package full cmos ldo regulator (500ma) buxxth5wnvx general description buxxth5wnvx is high-performance full cmos regulator with 500-ma output, which is mounted on versatile package sson004x1010 (1.00mm 1.00 mm 0.60mm). it has excellent ripple rejection, noise characteristics and load responsiveness characteris tics despite its low circuit current consumption of 10 m a. it is most appropriate for various applications such as p ower supplies for logic ic, rf, and camera modules. features high accuracy detection high ripple rejection low current consumption compatible with small ceramic capacitor (cin=co=1.0uf) with built-in output discharge circuit on/off control of output voltage with built-in over current protection circuit typical application circuit key specifications load current: 500ma accuracy output voltage: 1.0% power supply rejection ratio: 80db@1khz low current consumption: 10 a (typ) operating temperature range: -20c to +85c applications smartphone, battery-powered portable equipment, etc . package sson004x1010 : 1.00mm x 1.00mm x 0.60mm figure 1. application circuit v in gnd ce gnd gnd v out v out v in 1.0f ce 1.0f
2/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 connection diagram pin descriptions ordering information b u x x t h 5 w n v x - 1 t l part output voltage high ripple rejection with package none: packageing and forming specification number 1a : 1.05v maximum output current output discha rge nvx : sson004x1010 chip rev.1 embossed tape and re el ? 500ma 1: tl : the pin number 1 is the lower left 35 : 3.50v chip rev.2 (xx=1a,12) lineup marking di ci 6i ai output voltage 1.05v 1.20v 2.85v 3.50v part number BU1ATH5WNVX-1 bu12th5wnvx-1 bu2jth5wnvx bu35th5wnvx sson004x1010 top view 1 vout 2 gnd 3 ce 4 vin part number marking lot number 1pin mark sson004x1010 pin no. symbol function 1 vout output voltage 2 gnd grounding 3 ce on/off control of output voltage (high: on, low: off) 4 vin power supply voltage reverse fin substrate (connect to gnd) sson004x1010 (unit : mm) 1.0 0.1 1.0 0.1 1pin mark 0.6max 0.02 +0.03- 0.02 s 0.05 (0.12) 0.65 0.05 0.48 0.05 0.07 0.1 0.25 0.05 0.25 0.1 1 45o 4 2 3 3-c0.18 r0.05 0. 48 0.05 0.32 0.1 * order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the left hand 5000pcs tl ( ) direction of feed reel 1pin bottom view 1 vout 2 gnd 3 ce 4 vin reverse fin
3/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage vmax -0.3 to +6.5 v power dissipation pd 560 (note1) mw maximum junction temperature tjmax +125 c operating temperature range topr -20 to +85 c storage temperature range tstg -55 to +125 c (note1) pd deleted at 5.6mw/c at temperatures above ta=25c, mounted on 70701.6 mm glass-epoxy pcb. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a shor t circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection mea sures, such as adding a fuse, in case the ic is ope rated over the absolute maximum ratings. recommended operating range (not to exceed pd) parameter symbol limit unit power supply voltage vin 1.7 to 6.0 v maximum output current imax 500 ma operating conditions parameter symbol min. typ. max. unit condition input capacitor cin 1.0 (note2) - - f ceramic capacitor recommended output capacitor co 1.0 (note2) - - f ( note2) make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, dc bias, changing as time progresses characteristic. electrical characteristics (ta=25c, v in = v out +1.0v, c in =1.0 f, co=1.0 f, unless otherwise noted.) parameter symbol limits unit conditions min. typ. max. input voltage v in 1.7 - 6.0 v output voltage v out v out -25mv v out v out +25mv v i out =10a, vout 2.5v v out 0.99 v out 1.01 v i out =10a, vout R 2.5v line regulation S v out-line - - 20 mv from (v out +0.3v) to 5.0v, i out =10ma load regulation S v out-load - 21 40 mv i out =5ma to 250ma voltage dropout S v drop-out - 520 700 mv vout=1.05v (iout=250ma) - 440 550 mv vout=1.20v (iout=250ma) - 160 250 mv vout=2.85v (iout=250ma) - 150 230 mv vout=3.50v (iout=250ma) load current i load 500 - - ma no load quiescent current i cq - 10 20 a i out =0ma power supply rejection ratio rr1 - 82 - db f rr =100hz rr2 - 80 - db f rr =1khz output noise voltage noise - 40 - nv hz @10khz operating temperature range topr -20 - 85 c discharge resistor rdsc 20 50 80 ? ce pin pull-down current istb 0.1 0.9 8.0 ua ce pin control voltage on v ceh 1.2 - 6.0 v off v cel -0.3 - 0.3 v
4/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 block diagrams figure 2. block diagrams c in ??? 1.0 f (ceramic capacitor) co ??? 1.0 f (ceramic capacitor) c in v in gnd ce v out v out co v ref ocp v in ce
5/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu1ath5wnvx (ta=25oc unless otherwise specified.) figure 3. figure 4. figure 5. figure 6. lineregulation 0.99 1.00 1.01 1.02 1.03 1.04 1.05 1.06 1.07 1.08 1.7 2.0 2.3 2.6 2.9 3.2 3.5 vin[v] vout[v] -20 25 85 ce=vin iout=10ma output voltage vs temperature 0.95 1.00 1.05 1.10 1.15 -20 0 20 40 60 80 temperature[] vout[v] vin=2.5v ce=vin iout=10ua ground pin current vs input voltage 0 5 10 15 20 1.7 2.0 2.3 2.6 2.9 3.2 3.5 vin[v] ignd[ua] -20 25 85 ce=vin iout=0ma 0.950 1.000 1.050 1.100 1.150 0 50 100 150 200 250 300 vout [v] iout[ma] load regulation -20 25 85 vin=2.5v ce=vin
6/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu1ath5wnvx (ta=25oc unless otherwise specified.) figure 8. figure 7. figure 12. figure 11. figure 10. figure 9. ground pin current vs temperature 0 2 4 6 8 10 12 14 16 18 20 -20 0 20 40 60 80 temperature[] ignd[ua] vin=2.5v ce=vin iout=0ma ground pin current vs load 0 100 200 300 0 100 200 300 400 500 iout [ma] ignd [ua] vin=2.5v ce=vin ta=25 o c p 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 500 600 700 800 900 1000 1100 i o u t [ m a ] v o u t [ v ] vin=2.5v ce=vin ta=25 vout 200us/div 2.5v 3.5v vin ce=vin ta=25 iout=10ma 100mv/div 500mv/div line transient response vout 1.05v 2.5v 3.5v vin ce=vin ta=25 iout=150ma 100mv/div 500mv/div line transient response vout 1.05v 200us/div psrr vs frequency 0 10 20 30 40 50 60 70 80 90 100 100 1,000 10,000 100,000 1,000,000 frequency[hz] psrr[db] vin=2.5v ce=vin ta=25
7/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu1ath5wnvx (ta=25oc unless otherwise specified.) figure 13. figure 14. figure 15. shutdown current vs input voltage 0.01 0.10 1.00 10.00 -20 0 20 40 60 80 temperature[] istby[ua] vin=5.5v ce=0v figure 16. vin=2.5v ta=25 iout=0ma cout=1.0uf 0v ce vout 20?s/div 1v/div start up time 1v/div 1.5v 1v/div 1v/div 40?s/div 0v ce vout 1.5v discharge time vin=2.5v ta=25 iout=0ma cout=1.0uf 1ma 250ma iout vout trise=12us 20?s/div 200ma/div 200mv/div load transient response vin=2.5v ce=vin ta=25
8/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 1.14 1.15 1.16 1.17 1.18 1.19 1.20 1.21 1.22 1.23 1.7 2.0 2.3 2.6 2.9 3.2 3.5 vout[v] vin[v] line regulation -20 25 85 ce=vin iout=10ma ce=vin iout=10ma ce=vin iout=10ma ce=vin iout=10ma 1.100 1.150 1.200 1.250 1.300 0 50 100 150 200 250 300 vout [v] iout[ma] load regulation -20 25 85 vin=2.5v ce=vin 1.10 1.15 1.20 1.25 1.30 -20 0 20 40 60 80 vout[v] temperature[] output voltage vs temperature vin=2.5v ce=vin iout=10ua reference data bu12th5wnvx-1 (ta=25oc unless otherwise specified.) figure 17. figure 18. figure 19. figure 20. ground pin current vs input voltage 0 5 10 15 20 1.7 2.0 2.3 2.6 2.9 3.2 3.5 vin[v] ignd[ua] -20 25 85 ce=vin iout=0ma
9/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 100 200 300 400 500 600 700 800 900 1000 1100 v o u t [ v ] i o u t [ m a ] o c p vin=2.5v ce=vin ta=25 0 10 20 30 40 50 60 70 80 90 100 100 1,000 10,000 100,000 1,000,000 psrr[db] frequency[hz] psrr vs frequency vin=2.5v ce=vin vout 200us/div 2.5v 3.5v vin ce=vin ta=25 iout=10ma 100mv/div 500mv/div line transient response vout 1.2v 2.5v 3.5v vin ce=vin ta=25 iout=150ma 100mv/div 500mv/div line transient response vout 1.2v 200us/div reference data bu12th5wnvx-1 (ta=25oc unless otherwise specified.) figure 22. figure 21. figure 26. figure 25. figure 24. figure 23. ground pin current vs temperature 0 2 4 6 8 10 12 14 16 18 20 -20 0 20 40 60 80 temperature[] ignd[ua] vin=2.5v ce=vin iout=0ma ground pin current vs load 0 100 200 300 0 100 200 300 400 500 iout [ma] ignd [ua] vin=2.5v ce=vin ta=25
10/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 1ma 250ma iout vout trise=12us 20?s/div 200ma/div 200mv/div load transient response vin=2.5v ce=vin reference data bu12th5wnvx-1 (ta=25oc unless otherwise specified.) figure 27. figure 28. figure 29. shutdown current vs input voltage 0.01 0.10 1.00 10.00 -20 0 20 40 60 80 temperature[] istby[ua] vin=5.5v ce=0v figure 30. vin=2.5v ta=25 iout=0ma cout=1.0uf 0v ce vout 20?s/div 1v/div start up time 1v/div 1.5v 1v/div 1v/div 40?s/div 0v ce vout 1.5v discharge time vin=2.5v ta=25 iout=0ma cout=1.0uf
11/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu2jth5wnvx (ta=25oc unless otherwise specified.) figure 31. figure 32. figure 33. figure 34. lineregulation 2.79 2.80 2.81 2.82 2.83 2.84 2.85 2.86 2.87 2.88 3.3 3.8 4.3 4.8 vin[v] vout[v] -20 25 85 ce=vin iout=10ma output voltage vs temperature 2.75 2.80 2.85 2.90 2.95 -20 0 20 40 60 80 temperature[] vout[v] vin=3.85v ce=vin iout=10ua ground pin current vs input voltage 0 5 10 15 20 3.9 4.4 4.9 5.4 vin[v] ignd[ua] -20 25 85 ce=vin iout=0ma 2.750 2.800 2.850 2.900 2.950 0 50 100 150 200 250 300 vout [v] iout[ma] load regulation -20 25 85 vin=3.85v ce=vin
12/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu2jth5wnvx (ta=25oc unless otherwise specified.) figure 36. figure 35. ground pin current vs load 0 100 200 300 0 100 200 300 400 500 iout [ma] ignd [ua] vin=3.85v ce=vin ta=25 ground pin current vs temperature 0 2 4 6 8 10 12 14 16 18 20 -20 0 20 40 60 80 temperature[] ignd[ua] vin=3.85v ce=vin iout=0ma figure 40. figure 39. figure 38. figure 37. ocp 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 100 200 300 400 500 600 700 800 900 1000 1100 iout [ma] vout [v] vin=3.85v ce=vin ta=25 psrr vs frequency 0 10 20 30 40 50 60 70 80 90 100 100 1,000 10,000 100,000 1,000,000 frequency[hz] psrr[db] vin=4.3v ce=vin ta=25 200us/div 3.2v 4.2v vin ce=vin ta=25 iout=10ma 100mv/div 500mv/div line transient response vout 2.85v 3.2v 4.2v vin ce=vin ta=25 iout=150ma 100mv/div 500mv/div line transient response vout 2.85v 200us/div
13/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu2jth5wnvx (ta=25oc unless otherwise specified.) figure 41. figure 42. vin=3.85v ta=25 iout=0ma cout=1.0uf 0v ce vout 20?s/div 1v/div start up time 1v/div 1.5v 1v/div 1v/div 40?s/div 0v ce vout 1.5v discharge time vin=3.85v ta=25 iout=0ma cout=1.0uf figure 43. 1ma 250ma iout vout trise=12us 20?s/div 200ma/div 200mv/div load transient response vin=3.85v ce=vin ta=25 shutdown current vs input voltage 0.01 0.10 1.00 10.00 -20 0 20 40 60 80 temperature[] istby[ua] vin=5.5v ce=0v figure 44.
14/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu35th5wnvx (ta=25oc unless otherwise specified.) figure 45. figure 46. figure 47. figure 48. lineregulation 3.45 3.46 3.47 3.48 3.49 3.50 3.51 3.52 3.53 3.54 3.55 4.0 4.5 5.0 5.5 vin[v] vout[v] -20 25 85 ce=vin iout=10ma output voltage vs temperature 3.40 3.45 3.50 3.55 3.60 -20 0 20 40 60 80 temperature[] vout[v] vin=4.5v ce=vin iout=10ua ground pin current vs input voltage 0 5 10 15 20 4.0 4.5 5.0 5.5 vin[v] ignd[ua] -20 25 85 ce=vin iout=0ma 3.400 3.450 3.500 3.550 3.600 0 50 100 150 200 250 300 vout [v] iout[ma] load regulation -20 25 85 vin=4.5v ce=vin
15/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu35th5wnvx (ta=25oc unless otherwise specified.) figure 50. figure 49. figure 54. figure 53. figure 52. figure 51. ground pin current vs temperature 0 2 4 6 8 10 12 14 16 18 20 -20 0 20 40 60 80 temperature[] ignd[ua] vin=4.5v ce=vin iout=0ma ground pin current vs load 0 100 200 300 400 0 100 200 300 400 500 iout [ma] ignd [ua] vin=4.5v ce=vin ta=25 o c p 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 i o u t [ m a ] v o u t [ v ] vin=4.5v ce=vin ta=25 vout 200us/div 4.0v 5.0v vin ce=vin ta=25 iout=10ma 100mv/div 500mv/div line transient response vout 3.50v 4.0v 5.0v vin ce=vin ta=25 iout=150ma 100mv/div 500mv/div line transient response vout 3.50v 200us/div psrr vs frequency 0 10 20 30 40 50 60 70 80 90 100 100 1,000 10,000 100,000 1,000,000 frequency[hz] psrr[db] vin=4.5v ce=vin ta=25
16/20 14.dec.2015.rev.004 buxxth5wnvx datasheet tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data bu35th5wnvx (ta=25oc unless otherwise specified.) figure 55. figure 56. figure 57. figure 58. 1ma 250ma iout vout trise=12us 20?s/div 200ma/div 200mv/div load transient response vin=4.5v ce=vin ta = 25 shutdown current vs input voltage 0.01 0.10 1.00 10.00 -20 0 20 40 60 80 temperature[] istby[ua] vin=5.5v ce=0v 1v/div 1v/div 40?s/div 0v ce vout 1.5v discharge time vin=4.5v ta=25 iout=0ma cout=1.0uf vin=4.5v ta=25 iout=0ma cout=1.0uf 0v ce vout 20?s/div 1v/div start up time 1v/div 1.5v
17/20 14.dec.2015.rev.004 tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 buxxth5wnvx datasheet about power dissipation (pd) as for power dissipation, an approximate estimate o f the heat reduction characteristics and internal p ower consumption of ic are shown, so please use these for reference. si nce power dissipation changes substantially dependi ng on the implementation conditions (board size, board thickn ess, metal wiring rate, number of layers and throug h holes, etc.), it is recommended to measure pd on a set board. exceeding the power dissipation of ic may lead to deteriorati on of the original ic performance, such as reduction in current capabi lity. therefore, be sure to prepare sufficient marg in within power dissipation for usage. calculation of the maximum internal power consumpti on of ic (pmax) pmax=(vin-vout)iout(max.) (vin: input voltage vout: output voltage iout(max): maximum output current) measurement conditions standard rohm board evaluation board 1 layout of board for measurement ic implementation position top layer (top view) top layer (top view) bottom layer (top view) bottom layer (top view) measurement state with board implemented (wind spee d 0 m/s) with board implemented (wind speed 0 m/s) board material glass epoxy resin (double-side board ) glass epoxy resin (double-side board) board size 70 mm x 70 mm x 1.6 mm 40 mm x 40 mm x 1 .6 mm wiring rate top layer metal (gnd) wiring rate: approx. 0% metal (gnd) wiring rate: approx. 50% bottom layer metal (gnd) wiring rate: approx. 50% metal (gnd) wi ring rate: approx. 50% through hole diameter 0.5mm x 6 holes diameter 0.5m m x 25 holes power dissipation 0.56w 0.39w thermal resistance ja=178.6c/w ja=256.4c/w * please design the margin so that pmax becomes is than pd (pmax < pd) within the usage temperature range figure 59. sson004x1010 power dissipation heat reduction characteristics (r eference) 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 ta [ ] pd [w] 0.56w 85 0.39w
18/20 14.dec.2015.rev.004 tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 buxxth5wnvx datasheet operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impeda nce supply lines. separate the ground and supply li nes of the digital and analog blocks to prevent noise in the g round and supply lines of the digital block from af fecting the analog block. furthermore, connect a capacitor to ground a t all power supply pins. consider the effect of tem perature and aging on the capacitance value when using electroly tic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient c ondition. 4. ground wiring pattern when using both small-signal and large-current grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that t he ground traces of external components do not caus e variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating b e exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the ab solute maximum rating of the pd stated in this spec ification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass ep oxy board. in case of exceeding this absolute maxim um rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the internal powering sequen ce and delays, especially if the ic has more than o ne power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wir ing, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electr omagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ics power su pply should always be turned off completely before connecting o r removing it from the test setup during the inspec tion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in between pi ns during assembly to name a few.
19/20 14.dec.2015.rev.004 tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 buxxth5wnvx datasheet operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high i mpedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transisto r and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected t o the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are i nevitably formed creating parasitic diodes or trans istors. the operation of these parasitic elements can result in mutual in terference among circuits, operational faults, or p hysical damage. therefore, conditions which cause these parasitic e lements to operate, such as applying a voltage to a n input pin lower than the ground voltage should be avoided. furtherm ore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the po wer supply voltage is applied, make sure that the i nput pins have voltages within the values specified in the electri cal characteristics of this ic. 13. voltage of ce pin to enable standby mode for all channels, set the ce pin to 0.3 v or less, and for normal operation, to 1.2 v or more. setting ce to a voltage between 0.3 and 1.2 v may c ause malfunction and should be avoided. keep transi tion time between high and low (or vice versa) to a minimum. additionally, if ce is shorted to vin, the ic will switch to standby mode and disable the output disch arge circuit, causing a temporary voltage to remain on the output pin. if the ic is switched on again while this voltage is present, overshoot may occur on the output. therefore, in ap plications where these pins are shorted, the output should always be completely discharged before turning the ic on. 14. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 15. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent prot ection circuit that is activated when the load is s horted. this protection circuit is effective in preventing damag e due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by contin uous operation or transitioning of the protection c ircuit.
20/20 14.dec.2015.rev.004 tsz02201-0gbg0a600020-1- 2 www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 buxxth5wnvx datasheet revision history date revision changes 27.mar.2014 001 new release. 27.may.2014 002 adding a lineup. reference data load regulation extension of iout. ce pin control voltage is changed. 4.nov.2015 003 adding chip rev2 to line up of p2. 14.dec.2015 004 adding evaluation result of BU1ATH5WNVX-1 and b u12th5wnvx-1.
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperatur e. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu12th5wnvx-1 package sson004x1010 unit quantity 5000 minimum package quantity 5000 packing type taping constitution materials list inquiry rohs yes bu12th5wnvx-1 - web page distribution inventory

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